Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G
measures all wafer materials including Silicon, Gallium-Arsenide,
Indium-Phosphide and wafers mounted to sapphire or tape.the
powerful software can test all the data above within several
seconds,all the design according to SEMI standard and the ASTM,make
sure the data can be easily unify. the system can used for several
sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
Semi-automation system, can improve the measure thoughput.
Can be used on all wafer materials including: SiliconGallium-ArsenideIndium PhosphideGermanium.
Thickness and TTV values are obtained by placing the wafer between
non-contact capacitance probes.
Thickness and TTV values are indicated on the high resolution LCD
Provides High Performance at Low Cost.
Menu-driven for Fast, Easy Setup.
High-resolution LCD Display.
RS-232 Output Port to PC.
Parallel Port for Printer.
Portable and Easy to Set Up
provides the user precise non-contact measurements at critical
points throughout the wafer manufacturing process.
On-board Microprocessor for Accurate, Repeatable Measurements.
Teflon Wafer Stage for Easy, Non-abrasive Positioning.
Wafer Sizes: 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
Measurement Range: 1mm standard [1.7 mm Extended]
Thickness Accuracy: +/-0.25um