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Laptop CPU Processors , I7-6600U SF2F1 CORE I7 Series Notebook Cpu

Categories Laptop CPU Processors
Brand Name: INTEL
Model Number: I7-6600U SF2F1
Place of Origin: Orignal
MOQ: 1 piece
Price: Negotiation
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500-2000pcs per month
Delivery Time: 3-5 work days
Packaging Details: 10cm X 10cm X 5cm
Certification: Original Parts
Processor number: i7-6600U SF2F1
Products Collection: 6th Generation Intel Core I7 Processor
Code Name: SKYLAKE
Vertical Segment: Mobile
Status: Launched
Socket Type: FCBGA1356
Launch Date: Q3'15
Use Condition: PC/Client/Tablet
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    Laptop CPU Processors , I7-6600U SF2F1 CORE I7 Series Notebook Cpu

    Laptop CPU Processors , I7-6600U SF2F1 CORE I7 Series Notebook Cpu FCBGA1356 Package

    Core i7-6600U is Laptop's low voltage CPU is mainly used for daily office books.It is

    a 64-bit dual-core high-end performance mobile microprocessor introduced by Intel in late 2015. Fabricated on a 14 nm process based on the Skylake microarchitecture, this processor operates at 2.6 GHz with a turbo boost of up to 3.4 GHz. The i7-6600U has a TDP of 15 W with a configurable TDP-down of 7.5 W (800 MHz) and a configurable TDP-up of 25 W (2.8 GHz). This chip incorporates the HD Graphics 520 GPU operating at 300 MHz with a burst frequency of 1.05 GHz. This processor supports up to 32 GiB of non-ECC dual-channel DDR4-2133 memory.

    General information:

    TypeCPU / Microprocessor
    Market segmentMobile
    FamilyIntel Core i7 Mobile
    Model numberi7-6600U
    Frequency2600 MHz
    Maximum turbo frequency3400 MHz (1 core)
    3200 MHz (2 cores)
    Clock multiplier26
    Package1356-ball micro-FCBGA
    Size1.65" x 0.94" / 4.2cm x 2.4cm
    Introduction dateSeptember 1, 2015 (announcement)
    September 1, 2015 (availability in Asia)
    September 27, 2015 (availability elsewhere)

    Architecture / Microarchitecture:

    Processor coreSkylake-U
    Core steppingD1 (SR2F1)
    Manufacturing process0.014 micron
    Data width64 bit
    The number of CPU cores2
    The number of threads4
    Floating Point UnitIntegrated
    Level 1 cache size2 x 32 KB 8-way set associative instruction caches
    2 x 32 KB 8-way set associative data caches
    Level 2 cache size2 x 256 KB 4-way set associative caches
    Level 3 cache size4 MB 16-way set associative shared cache
    Physical memory32 GB
    MultiprocessingNot supported
    Extensions and Technologies
    • MMX instructions
    • SSE / Streaming SIMD Extensions
    • SSE2 / Streaming SIMD Extensions 2
    • SSE3 / Streaming SIMD Extensions 3
    • SSSE3 / Supplemental Streaming SIMD Extensions 3
    • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
    • AES / Advanced Encryption Standard instructions
    • AVX / Advanced Vector Extensions
    • AVX2 / Advanced Vector Extensions 2.0
    • BMI / BMI1 + BMI2 / Bit Manipulation instructions
    • F16C / 16-bit Floating-Point conversion instructions
    • FMA3 / 3-operand Fused Multiply-Add instructions
    • EM64T / Extended Memory 64 technology / Intel 64
    • NX / XD / Execute disable bit
    • HT / Hyper-Threading technology
    • VT-x / Virtualization technology
    • VT-d / Virtualization for directed I/O
    • TBT 2.0 / Turbo Boost technology 2.0
    • TXT / Trusted Execution technology
    • TSX / Transactional Synchronization Extensions
    • MPX / Memory Protection Extensions
    • SGX / Software Guard Extensions
    Low power featuresEnhanced SpeedStep technology

    Integrated peripherals / components:

    Display controller3 displays
    Integrated graphicsGPU Type: HD 520
    Graphics tier: GT2
    Microarchitecture: Gen 9 LP
    Execution units: 24
    Base frequency (MHz): 300
    Maximum frequency (MHz): 1050
    Memory controllerThe number of controllers: 1
    Memory channels: 2
    Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133
    Maximum memory bandwidth (GB/s): 34.1
    Other peripherals
    • PCI Express 3.0 interface (12 lanes)
    • SATA controller
    • USB controller
    • USB OTG
    • eMMC 5.0
    • SDXC 3.0
    • Legacy I/O

    Electrical / Thermal parameters:

    Maximum operating temperature100°C
    Thermal Design Power15 Watt

    Product Tags:

    laptop microprocessor


    laptop chips

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