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Hei-Si Strap Flip-Chip Bonding Equipment

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    • Product Details
    • Company Profile

    Hei-Si Strap Flip-Chip Bonding Equipment

    • Model NO.: HEI-SI
    • Certification: SGS, RoHS, CE
    • Shape: Irregular Shape
    • Chip Type: Read/Write
    • Power Supply Mode: Passive
    • Usage: Electronic Products, Luggage, Jewelry, Book, Garment, Shoe, Bag
    • Material: PE
    • Trademark: HIT
    • Package: Pet, PVC, Pi, Paper
    • Specification: 0.38*0.38~1.2*1.2mm2
    • Origin: China
    • HS Code: 8501109101
    Product Description
    Features:
    Substrate transport module dispensing module flip chip module,final bonding module and detection module are integrated in HEI-SIand HEI-SI can be applied to the mass production of RFID strap

    The users can get HF/UHF inlay by compile module with differentkind of material
    Industry-leading strap packaging technology, greatly simplifythe difficulty of ultra-small chip and lower the requirements ofantennas
    Using patented technology of thimble, flip head, placement headand realizing the package of ultra-small chip (0.38 x 0.38mm)

    Motion accuracy of substrate transport module dispensingmodule, flip module can be guaranteed by 4 high-precision visionsystems, the accuracy of wafer can be ±1¼m and theaccuracy of flip can be ±20¼m

    A number of patented technologies can guarantee the yield byautomatic detect the bad chips in wafer
    Applicable to HF/UHF inlay of goods management and tracing,commodity security and management and logistics monitoring
    Product Tags:

    power supply

      
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