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Prototype Laser Drill pcb double sided In Calculator Application , HASL - LF Surface

Categories Fr4 PCB
Brand Name: XCE
Model Number: XCEM
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin: China
MOQ: 1pcs
Price: negotiation
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Delivery Time: 5-10 days
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Material: FR4
Layer: 2
Color: Green
Min line space: 5mil
Min line width: 5mil
Copper thickness: 1OZ
Board size: 99*82mm
Panel: 1
Surface: HASL-LF
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    Prototype Laser Drill pcb double sided In Calculator Application , HASL - LF Surface

    Prototype Laser Drill pcb double sided In Calculator Application , HASL - LF Surface


    Quick detail:

    Origin:ChinaSpecial: FR4 Material
    Layer:2Thickness:1.6mm
    Surface: HASL-LFHole:0.5

    Double-Side Prototype Laser Drill PCB In Calculator Application In Green Soldermask HASL-LF Surface


    Model Number:XCEPCB003

    Shipping port:ShenZhen/HongKong

    Place of origin:GuangDong,China

    Delivery Time:3-10 Working Days

    Production capacity:FR4:2000000Sqms High Frequency board:10000Sqms

    Price Terms:FOB

    Minimum Order Quantity:1pc

    Payment terms:TT,Paypal,Western Union

    Certification:CE,ROHS,FCC,ISO9008,SGS,UL


    Liquid photo solder resist (commonly known as green oil) is a protective layer coated on the printed circuit board without welding line and the substrate, or as a solder resist. Aim is long-term protection circuit patterns formed.
    Liquid photoimageable solder resist ink main ingredients include: epoxy and acrylic resins having a photosensitive properties, such as Bisphenol epoxy resin, phenol resin, phenol epoxy resin and amine methyl and ethyl; photoinitiator such as thioxanthone, benzophenone, carbonyl compounds, ketones investigation, amine organic metal compound; fillers such as silica powder; hardeners, such as an aromatic ester, acid anhydride, imidazole sigh class; solvent, such as ether esters class; defoamers and the like. The coating method is generally used serigraphy, and similar wet film.
    Its role is as follows:
    (1) preventing the physical disconnection of the conductor circuit;
    (2) welding process, to prevent a short circuit due to bridging generated;
    (3) must be welded only in part for welding, solder avoid waste;
    (4) reduction of copper welding tank pollution;
    (5) to prevent dust, moisture and other environmental factors cause insulation deterioration, corrosion;
    (6) having a high insulation resistance, high-density circuit becomes possible.


    Parameter:


    oItemData
    1Layer:1 to 24 layers
    2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    3Board thickness:0.20mm to 3.4mm
    4Copper thickness:0.5 OZ to 4 OZ
    5Copper thickness in hole:>25.0 um (>1mil)
    6Max. Board Size:(580mm×1200mm)
    7Min. Drilled Hole Size:4mil(0.1mm)
    8Min. Line Width:3mil (0.075mm)
    9Min. Line Spacing:3mil (0.075mm)
    10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
    11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
    12Shape tolerance:±0.13
    13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
    14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
    15Certificate:UL,SGS,ISO 9001:2008
    16Special requirements:Buried and blind vias+controlled impedance +BGA
    17Profiling:Punching, Routing, V-CUT, Beveling

    Features


    • High Thermal Performance
     Tg: 180°C (DSC)
     Td: 340°C (TGA @ 5% wt loss)
     Low CTE for reliability
    • T260: 60 minutes
    • T288: 30 minutes
    • RoHS Compliant
    • UV Blocking and AOI Fluorescence
     High throughput and accuracy during PCB
    fabrication and assembly
    • Superior Processing
     Closest to conventional FR-4 processing
    • Core Material Standard Availability
     Thickness: 0.002″ (0.05 mm) to 0.125″
    (3.2 mm)
     Available in full size sheet or panel form
    • Prepreg Standard Availability
     Roll or panel form
     Tooling of prepreg panels available
    • Copper Foil Type Availability
     Standard HTE Grade 3
     RTF (Reverse Treat Foil)
    • Copper Weights
     ½, 1 and 2 oz (18, 35 and 70 μm) available
     Heavier copper available upon request
     Thinner copper foil available upon request
    • Glass Fabric Availability
     Standard E-glass
     Square weave glass fabric available
     Spread glass fabric available
    • Industry Approvals
     IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
     UL - File Number E41625 as PCL-FR-370HR
     Qualified to UL's MCIL Program


    Rogers material in stock:


    BrandModelThickness(mm)DK(ER)
    F4BF4B0.382.2
    F4B0.552.23
    F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
    F4Bk0.8,1.52.65
    F4B0.83.5
    FE=F4BM12.2
    RogersRO40030.254 0.508,0.813,1.5243.38
    RO43500.254 0.508,0.762,1.5243.5
    RO58800.254.0.508.0.7622.2
    RO30030.127,0.508,0.762,1.5243
    RO30100.63510.2
    RO32060.635MM10.2
    R030350.508MM3.5
    RO60100.635MM, 1,27MM10.2

    Q:Are you Factory or Trade company?

    A:We are factory manufacturer,welcome to visit our factory.

    Q:What kind of PCB file format can you accept for production?

    A:Gerber, PROTEL 99SE, PROTEL DXP, POWER PCB

    Q:Can you accept copy board?

    A:Yes,if you have pcb sample,can send to us,not only for PCB board,but also for PCBA,we can accept copy board

    Q:How about your factory production capacity?

    A:FR4:2000000Sqms High Frequency board:10000Sqms

    Quality Prototype Laser Drill pcb double sided In Calculator Application , HASL - LF Surface for sale
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