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| Categories | High Frequency PCB |
|---|---|
| Brand Name: | FASTPCB |
| Place of Origin: | CHINA |
| PCB type: | 77G Millimeter Wave Radar High Frequency Board |
| Base Material: | Rogers ro3003g2 + Shengyi s1000-2m |
| Number of Layers: | 8 Layer |
| Copper Thickness: | 1Oz. |
| Board Thickness: | 1.4mm |
| Min. Hole Size: | 0.25mm |
| Min. Line Width: | 0.100mm |
| Min. Line Spacing: | 0.112mm |
| Surface Finishing: | Immersion Gold |
| application area: | Automobile driverless 77g anti-collision radar |
| Dielectric constant: | 3.00 +/- 0.04 |
| Company Info. |
| Quanhong FASTPCB |
| View Contact Details |
| Product List |
Performance comparison between automobile driverless 24GHz
anti-collision radar and 77GHz millimeter wave radar:
1. With different frequencies, the wavelength of 24GHz millimeter
wave radar is greater than 10cm. Strictly speaking, 24GHz
millimeter wave radar belongs to centimeter wave radar
2. 77GHz millimeter wave radar meets both high transmission power
and wide working bandwidth, so that it can achieve long-range
detection and high-range resolution at the same time
3. 77 GHz millimeter wave radar has significant advantages in
object resolution, velocity measurement and ranging accuracy
4. 77GHz millimeter wave radar is smaller, and its wavelength is
less than 1 / 3 of 24GHz. Therefore, the area of transceiver
antenna is greatly reduced and the size of radar is reduced
At present, Rogers 3003g2 + Shengyi 1000-2m is used for 77GHz
millimeter wave radar PCB produced by QUANHONG, and the line
tolerance is + / - 0.02mm, which can be mature and mass produced
| Item | Technics capacity |
| Layers | 1--48 |
| Material | FR-4 , Insulated Metal Substrate,High frequency material etc. |
| Max. manufacturing size | 500mm X1200mm |
| Outline tolerance | ± 0.1mm |
| Board thickness range | 0.20mm--8.00mm |
| Board thickness tolerance (t≥1.0mm) | ± 10% |
| Board thickness tolerance(t＜1.0mm) | ± 0.1mm |
| Core thickness | 0.075mm--5.00mm |
| Min. trace width(HOZ base copper for outler layer ) | 0.075 mm |
| Min. trace space(HOZ base copper for outler layer ) | 0.075 mm |
| Min. trace width(1OZ base copper for outler layer ) | 0.125 mm |
| Min. trace space(1OZ base copper for outler layer ) | 0.125 mm |
| Min. trace width(2OZ base copper for outler layer ) | 0.18 mm |
| Min. trace space(2OZ base copper for outler layer ) | 0.18 mm |
| Min. trace width(3OZ base copper for outler layer ) | 0.23 mm |
| Min. trace space(3OZ base copper for outler layer ) | 0.23mm |
| Copper thickness for outer layers | 35um--175um |
| Copper thickness for inner layers | 17um--175um |
| Drilling holes size | 0.10mm--6.35mm |
| Finish holes size | 0.10mm--6.30mm |
| Hole size tolerance | ±0.05mm |
| Hole position tolerance | ±0.075mm |
| Aspect ratio | 12:1(drill hole>0.30MM) , 8:1(drill hole≤0.30MM) |
| Solder mask type | Liquid photoimageable solder resist ink |
| Solder mask color | white,black,blue,green,yellow,red etc. |
| Min. solder mask bridge | 0.125mm(black),other 0.10mm |
| Min. solder mask clearance ring | 0.05mm |
| Plug holes range | 0.25mm--0.65mm |
| Impedance tolerance | ± 10% |
| Au & Ni thickness for Immersion gold thickness Au thickness: | 2~4U",Ni thickness: 120~200U |
| Au & Ni thickness for gold fingers | Au thickness: 5~30U",Ni thickness: 120~200U |
| Copper in hole wall | 20~25UM |
| Surface finish type | Hasl/Lead free Hasl,Immersion gold,Immersion Tin,Immersion silver, OSP,etc |
Rigid PCB Manufacturing Capability
| Item | 2016 | 2017 | 2018 | |
| Number of Layers | General board | 2-36 | 2-40 | 2-40 |
| Buried IC | no | yes | yes | |
| HDI | 1- N-1 2- N-2 | 1- N-1 2- N-2 3- N-3 4- N-4 | 1- N-1 2- N-2 3- N-3 4- N-4 5- N-5 | |
| Materials | FR4 (Shengyi) | yes | yes | yes |
| High Tg | Tg-170 | Tg-210 | Tg-220 | |
| EHalongen Free | yes | yes | yes | |
| High Frequency | yes | yes | yes | |
| IVaximum board size | 20*30inch | 20*30inch | 20"35inch | |
| Board thickness | 0.21-6.0mm | 0.21-6.0mm | 0.21-6.0mm | |
| Minimum line width | 3mil-inner 3mil-outer | 2mil-inner 3mil-outer | 2mil-inner 2mil-outer | |
| Minimum Line gap | 3mil-inner 3mil-outer | 2mil-inner 3mil-outer | 2mil-inner 2mil-outer | |
| Outer layer copper thickness | 5OZ | 7OZ | 7OZ | |
| Inner layer copper thickness | 5OZ | 7OZ | 7OZ | |
| Min. finished hole size (Mechanical) | 0.15mm | yes | yes | yes |
| Min. finished hole size (laser hole) | 0.076mm | yes | yes | yes |
| Aspect ratio | 16: 1 | 20: 1 | 20: 1 | |
| Solder Mask Types and brand | NAYA(LP-4G) | yes | yes | yes |
| Tamura(TT19G) | yes | yes | yes | |
| TAIYO(PSR2000) | yes | yes | yes | |
| Solder Mask Color | green;blue;red;white;black | yes | yes | yes |
| Impedance Control Tolerance | 0.05 | yes | yes | yes |
| Plug via hole | Min. size can be pluqqed: | 0.1mm | 0.1mm | 0.1mm |
| Max. size can be plugged: | 0.70mm | 0.70mm | 0.70mm | |
| Min. annular ring can be kept | 3mil | 3mil | 3mil | |
| Min. distance between the IC pads can keep SM bridge | 8mil | 8mil | 8mil | |
| Min. SM bridge for green soldermask | 3mil | 3mil | 3mil | |
| Min. SM bridge for black soldermask | 4mil | 4mil | 4mil | |
| Surface Treatment | HASL | yes | yes | yes |
| ENIG | yes | yes | yes | |
| OSP I L A C LCLLttACl | yes | yes | yes | |
| LEAD FREE HASL GOLD | yes | yes | yes | |
| PLATING | yes | yes | yes | |
| IMMERSION Ag | yes | yes | yes | |
| IMMERSION Sn | yes | yes | yes | |
| V-Cut | CNC V-cut, degree | 20304560 | 20304560 | 20304560 |
| V-cut by hand, degree | 20304560 | 20304560 | 20304560 | |
| Outline Profile | CNC | CNC | CNC | |
| Chamfer | The angle type of the chamfer: | 203045 | 203045 | 203045 |
| Min. distance of jumping chamfer: | 5mm | 5mm | 5mm | |
| Tolerance of the dimension size | ±0.1mm | ±0.1mm | ±0.1mm | |
| Tolerance of the board thickness | 0.21-1.0 | ±0.1 | ±0.1 | ±0.1 |
| 1.0-2.5 | ±7% | ±7% | ±7% | |
| 2.5-6.3 | ±6% | ±6% | ±6% | |
| Tolerance of the finished hole size | 0-0.3mm | +0.08mm | +0.08mm | +0.08mm |
| 0.31—0.8mm | ±0.08mm | ±0.08mm | ±0.08mm | |
| 0.81-1.60mm | ±0.05mm | ±0.05mm | ±0.05mm | |
| 1.61-2. 49mm | ±075mm | ±0.75mm | ±0.75mm | |
| 2. 5-6. 0mm | +0.15/-0mm | +0.15/-0mm | +0.15/-1mm | |
| >6. 0mm | +0.3 /-Omm | +0. 3 /-0mm | +0. 3 /-1mm | |
Packaging & Delivery | |||||
Packaging Details: | Inner: vacuum packing or Anti-static package, | ||||
Port: | Shenzhen or Hongkong | ||||
Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
Est. Time(days) | 3-5 | 3-5 | 7-9 | To be negotiated | |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication,
SMT, plastic injection & metal,final assembly, testing and other
value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic
requirements(material,size, surface finish treatment, copper
thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side
local law and promising tokeep customers data in high confidential
level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home,
Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can
support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing
Street, Bao 'an District, Shenzhen, Guangdong province, China
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