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Rogers 4350 PCB Double Sided High Frequency Circuit Boards 10 Mil

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-8.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Based material: Rogers 4350
Layer count: 2 Layers
PCB thickness: 10 mil
Surface finsh: Immersion Gold
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Rogers 4350 PCB Double Sided High Frequency Circuit Boards 10 Mil

Rogers 4350 PCB 10 mil double sided High Frequency Circuit Boards


Rogers 4350 high frequency PCBs are made of hydrocarbon ceramic laminates which are designed to offer superior high frequency performance and low cost high volume applications. They are not PTFE that can be manufactured using standard epoxy/glass (FR-4) processes.


It has dielectric constant of 3.48,dissipation factor of 0.0037 at 10 GHz. Low dielectric tolerance and low loss allows applications with higher operating frequencies.


The expansion coefficient of roges 4350 circuits is similar to that of copper that allows the board exhibiting excellent dimensional stability. And it has a Tg of >280°C (536°F), so the expansion characteristics remain stable over the entire range of circuit processing temperatures.


Rogers RO4350B PCBs have been used sucessfullly more than 10 years in high power amplifiers, microwave power amplifiers, celluar base station antennas etc.


RO4350B Typical Value
PropertyRO4350BDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.48±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.66Z8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0037
0.0031
Z10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+50Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity1.2 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity5.7 x109COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength203(29.5)
130(18.9)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength255
(37)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/m
(mil/inch)
after etch+E2/150℃IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion10
12
32
X
Y
Z
ppm/℃-55℃to288℃IPC-TM-650 2.4.41
Tg>280℃ TMAAIPC-TM-650 2.4.24.3
Td390℃ TGAASTM D 3850
Thermal Conductivity0.69W/M/oK80℃ASTM C518
Moisture Absorption0.06%48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density1.86gm/cm323℃ASTM D 792
Copper Peel Stength0.88
(5.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability(3)V-0UL 94
Lead-free Process CompatibleYes


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