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| Categories | Aluminum Clad PCB |
|---|---|
| Brand Name: | Customized |
| Model Number: | Customized |
| Certification: | ISO9001/ISO14001/CE/RoHs |
| Place of Origin: | Shenzhen,China |
| MOQ: | 1 piece |
| Price: | negotiable |
| Payment Terms: | T/T |
| Supply Ability: | 100000 pin per month |
| Delivery Time: | 1-7 days |
| Packaging Details: | none |
| Base Material: | Aluminium |
| surface Finishing: | Immersion gold/sliver/tin,OSP,HASL |
| Copper thickness: | 1oz |
| Min.Line Width: | 3mils |
| Min.Line Space: | 3mils |
| Min.hole size: | 0.1mm |
| Application: | Led light |
| Company Info. |
| Shenzhen Fany Technology Co.,Ltd |
| View Contact Details |
| Product List |
Aluminum PCB Clad can be advantageous to use for their ability to integrate a dielectric polymer layer with a high thermal conductivity for a lower thermal resistance.
Metal core PCBs transfer heat 8 to 9 times faster than FR4 PCBs. Al PCB laminates dissipate heat, keeping heat generating components cooler which results in increased performance and life.
| Item | Technical Specification | |
| Number of Layers | 2-60 layers | |
| Laminate | CEM-3,FR4 (High Tg, Halogen Free),Rogers,Teflon, Arlon, Metal Base (Aluminum, Copper), Mixematerial Kapton, PI, PET for flex. | |
| Laminate Brand | KB,Shengyi,Nanya,Isola,Goword,grace,Rogers,Arlon,Taconic,Ventec and customer specify | |
| Maximum board size | 610X1 060mm | |
| Board thickness | 0.15-4.5mm | |
| Minimum line width | 4mils (1oz Cu finished) | |
| Minimum Line gap | 4mils(1oz Cu finished) | |
| Outer layer copper thickness | 1/3-12OZ | |
| Inner layer copper thickness | 1/3-14OZ | |
| Min. finished hole size (Mechanical) | 0.20mm | |
| Min. finished hole size (laser hole) | 0.075mm | |
| Aspect ratio | 10:01 | |
| Solder Mask Types and brand | Nanya,Taiyo | |
| Solder Mask Color | Gloss & matte green | |
| Impedance Control Tolerance | 10% | |
| Surface Treatment | HASL lead free,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger | |
| V-Cut | V-cut degree | 30+/-5 degree |
| Tol: +/-0.13mm | ||
| Chamfer | The angle type of the chamfer | 20,30, 45 Degree |
| Plug via hole | Min. size can be plugged | 0.15mm |
| Max. size can be plugged | 0.50mm | |
| Largest NPTH hole size | 6.50mm | |
| Largest PTH hole size | 6.50mm | |
| Min. annular ring can be kept | 6mils | |
| Min. distance between the IC pads can keep SM bridge | 8mils | |
| Min. SM bridge for green soldermask | 4 mils | |
| Min. SM bridge for black soldermask | 5mils | |
| Tolerance of outer dimension size | Tol: +/-0.13mm | |
| Tolerance of board thickness | T>=1.0mm, Tol: +/-10% T<1.0mm, Tol:+/-0.1mm | |
| Tolerance of finished PTH hole size | Tol: +/-0.075mm | |
| Specila Progress | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and Resistance contro | |
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