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Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field

Categories Diamond Grinding Wheel
Brand Name: SIGNI
Model Number: SS
Certification: ISO
Place of Origin: CN
MOQ: 1PC
Payment Terms: D/A, D/P, T/T, Western Union, MoneyGram
Delivery Time: 15 DAYS
Packaging Details: WOODEN CASE
Material: DIAMOND
Application: SAPPHIRE
OEM: yes
Size: as per required
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Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field

Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field

Product Features

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.


This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on the Japanese, Korean grinders with high performance.


Product Description

Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.


Material of workpiece: Synthetic sapphire, SiC, single crystal silicon.


Grinders: SHUWA, NTS, WEC, GALAXY, SPEEDFAM.


Quality Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field for sale
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