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Rogers 4003 High Frequency PCB Double Sided RF PCB Board For Antennas

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-009.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: RO4300C
PCB thickness: 0.3 mm ±0.1
PCB size: 58 x 110mm=1up
Copper weight: 35um
Layer count: Double sided
Surface finish: ENIG
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Rogers 4003 High Frequency PCB Double Sided RF PCB Board For Antennas


Rogers 4003 High Frequency PCB Double Sided RF PCB for Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Introduction of RO4003C material

The Rogers Corporation manufactures woven glass reinforced hydrocarbon ceramic-filled laminates known as RO4003C high frequency materials. It can be manufactured using materials made of epoxy resin and shares the same electrical characteristics as PTFE/woven glass. Once working frequencies reach 500 MHz and beyond, designers have a much smaller number of laminates to choose from. Designers of RF microwave circuits, matching networks, and controlled impedance transmission lines can rely on the features of RO4003C material. Higher operating frequencies prevent the use of standard circuit board materials in many applications, while low dielectric loss enables RO4003C material to be employed in those applications. The dielectric constant is consistent across a wide frequency range and has one of the lowest temperature coefficients of any circuit board material. The thermal coefficient of expansion (CTE) of the RO4003C material offers the PCB designers a number of significant advantages. Due to its identical expansion coefficient to that of copper, RO4003C exhibits high dimensional stability, a quality required for the creation of mixed dielectric multi-layer boards. Even in applications that need extreme thermal shock, the RO4003C's low Z-axis CTE ensures dependable plated through-hole quality. The expansion characteristics of the RO4003C material are steady over the whole temperature range of PCB processing thanks to its Tg of >280C.


PCB Specifications

PCB SIZE58 x 110mm=1up
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 35um(1 oz)+plate TOP layer
RO4003C 0.203mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:6 mil / 11 mil
Minimum / Maximum Holes:0.4 mm / 0.4 mm
Number of Different Holes:1
Number of Drill Holes:3
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL
Glass Epoxy:RO4003C Tg280, er<3.48, Rogers Corp.
Final foil external:1.5 oz
Final foil internal:N/A
Final height of PCB:0.3 mm ±0.1
PLATING AND COATING
Surface FinishImmersion gold, 19.5%
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAPlated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATINGN/A
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

Typical applications are as follows:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power amplifiers

RFID



Data Sheet of Rogers 4003C (RO4003C)

RO4003C Typical Value
PropertyRO4003CDirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.38±0.05Z10 GHz/23IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3.55Z8 to 40 GHzDifferential Phase Length Method
Dissipation Factortan,δ0.0027
0.0021
Z10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε+40Zppm/-50to 150IPC-TM-650 2.5.5.5
Volume Resistivity1.7 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity4.2 x 109COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
Tensile Modulus19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi)RTASTM D 638
Tensile Strength139(20.2)
100(14.5)
X
Y
MPa(ksi)RTASTM D 638
Flexural Strength276
(40)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability<0.3X,Ymm/m
(mil/inch)
after etch+E2/150IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion11
14
46
X
Y
Z
ppm/-55to288IPC-TM-650 2.4.41
Tg>280 TMAAIPC-TM-650 2.4.24.3
Td425 TGAASTM D 3850
Thermal Conductivity0.71W/M/oK80ASTM C518
Moisture Absorption0.06%48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density1.79gm/cm323ASTM D 792
Copper Peel Stength1.05
(6.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
FlammabilityN/AUL 94
Lead-free Process CompatibleYes


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