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no Stiffener Flexible PCB Board Polyimide Flex PCB For RFID Sensor

Categories Flexible PCB Board
Brand Name: Bicheng
Model Number: BIC-274.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Polyimide
Layer count: 2 layers
PCB thickness: 0.2mm
PCB size: 41.61 X 60.17mm
Coverlay: Yellow
Silkscreen: White
Copper weight: 1oz
Surface finish: Immersion gold
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no Stiffener Flexible PCB Board Polyimide Flex PCB For RFID Sensor

Double Sided Flexible PCB Coil Flexible Circuit Polyimide PCB with Immersion Gold for RFID Sensor

(FPC’s are custom-made products, the picture and parameters shown are just for reference)


General description

This is a type of flexible printed circuit for the application of RFID sensor. It’s a 2 layer FPC at 0.2mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.


Parameter and data sheet

Size of Flexible PCB41.61 X 60.17mm
Number of Layers2
Board Type
Flexible PCB
Board Thickness0.20mm
Board MaterialPolyimide 25µm
Board Material SupplierITEQ
Tg Value of Board Material60℃
PTH Cu thickness≥20 µm
Inner Iayer Cu thicknesN/A
Surface Cu thickness35 µm
Coverlay ColourYellow
Number of Coverlay2
Thickness of Coverlay25 µm
Stiffener Materialno
Stiffener ThicknessN/A
Type of Silkscreen InkIJR-4000 MW300
Supplier of SilkscreenTAIYO
Color of SilkscreenWhite
Number of Silkscreen1
Peeling test of CoverlayNo peelable
Legend Adhesion3M 90℃ No peeling after Min. 3 times test
Surface FinishImmersion Gold
Thickness of Nickle/GoldAu: 0.03µm(Min.); Ni 2-4µm
RoHS RequiredYes
Famability94-V0
Thermal Shock TestPass, -25℃±125℃, 1000 cycles.
Thermal StressPass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function100% Pass electrical test
WorkmanshipCompliance with IPC-A-600H & IPC-6013C Class 2


Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

The end can be whole soldered

Low cost

Continuity of processing

Provide small quantity, prototypes and production.

Make delivery on time. We keep higher than 98% on-time-delivery rate.


Applications

Instrument panel, mobile phone antenna flex board, tablet keypad flex board


Clarifications of FPC

According to the combination of base material and copper foil, flexible circuit board can be divided into two types: flexible board with adhesive and flexible board without adhesive. The price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB, but its flexibility, bonding force between copper foil and substrate and flatness of solder are also better than that of adhesive flexible PCB. So it is only used in the high demand situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the situation where bending is required, if the design or process is not reasonable, it is easy to produce micro-cracks, welding and other defects.


Economy of using FPC

If the circuit design is relatively simple, the total volume is small, and the space is suitable, the traditional internal connection is much cheaper. Flexible circuits are a good design option if the circuit is complex, processes many signals or has special electrical or mechanical requirements. When the size and performance of applications exceed the capacity of rigid circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is more reliable to mount the chip directly on the film. There is no flame retardant that could be an ion source. These films may be protective and solidified at higher temperatures to obtain higher glass transition temperatures. Flexible materials are less costly than rigid materials because they are free of connectors.


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