High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen

5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station

​Specification

Repair steps

1.Separate the BGA chip from mother board –we called desoldering.
2.Clean Pad.
3.Reballing or replace a new BGA chip directly.
4.Alignment/Positioning – Depend on experience ,silk frame ,optical camera.
5. replace a new BGA chip - we called Soldering hot air smd rework station iphone ic replace machine.

About Packaging

Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional technical team for R&D,but also have a outgoing and experienced marketing team for research and develop, grasps products developing directions, updates the products and technics to meet the continue changing demands. In the past years,we have been always keep innovating and exploing to make cost-efficient products to help our customers saving cost and labor, improving the production efficiency at the same time.
HSTECH set the goal for "High quality and Smart”, that based on the concept of "Quality-Oriented and Customer-orented", and combined the industry feature, smart technology persuit for the smart factory.As for the after-sale service, we insist on "responsibility", we will take reaction at the first when we got quality feedbacks,and service our customers all the time.