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WDS 520 Laser BGA Reballing Machine For Mobile Phone Laptop Motherboard

Categories Manual BGA Rework Station
Brand Name: WDS
Model Number: WDS-520
Certification: CE
Place of Origin: China
MOQ: 1 UNIT
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 150 UNITS PER MONTH
Delivery Time: 8-15 working days
Packaging Details: Wooden case
Application: Rework BGA
Keyword: Welding Robot China
Advantage: Low Weight
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WDS 520 Laser BGA Reballing Machine For Mobile Phone Laptop Motherboard

IR Preheater lead-free Infrared WDS-520 BGA Rework Station


Product Description


  • Our BGA Rework Station/BGA reballing station are widely used to replace and repair the BGA chip in laptop , mobile phone , xbox 360, ps3,etc.
  • The main user is repairing shops and factory to provide the after-sales service and rework.

Manual BGA Rework Station

Model:WDS-520

  1. Repair Success Rate:More Than 99%
  2. Using The Industriak Touche Screen
  3. Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat.(temperature accuracy ± 2°C)
  4. With CE Certification

Main Features

Operation System

  • Manual mode.
  • Can solder, desolder, mount, pick and replace chip.
  • User-friendly.

Strict Temperature Control System


  • 8 segments rising temperature/constant time/ temperature rising slope, it can save hundreds of groups temperature curve.
  • It adopts high accuracy K-type thermocouple close-loop control.
  • The external sensor can detect temperature precisely, analyze and calibrate the real temperature curve accurately at any time.

Safety Sustem

  • With CE cetification
  • With automatic power-off protection device when abnormal accident happens and double over-temp protection fuction.
Power supplyAC 220V ± 10% 50Hz
Total power3800W
Heater powerUpper temp.zone 800W, second temp.zone 1200W, IR temp.zone 1800W(1200W controlled)
Electrical material

Touch screen+Temperature control module+ microcontrollers

Locating wayV-shape card slot + Universal jigs
PCB sizeMax 300mm*280mm Min 10mm*10mm
Applicable chipsMax 60mm*60mm Min 1mm*1mm
PCB thickness0 .3-5mm
Overall dimensionL460mm*W480mm*H500mm
Weight of machineAbout 30KG
UsageRepair chips/phone motherboard etc.

Quality WDS 520 Laser BGA Reballing Machine For Mobile Phone Laptop Motherboard for sale
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