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20.7mil RO 4003C LoPro Double Layer Printed Circuit Board Hydrocarbon Ceramic

Categories Rogers PCB Board
Brand Name: Bicheng
Model Number: BIC-131.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Hydrocarbon Ceramic Laminates
Layer count: Double Layer, Multilayer, Hybrid PCB
PCB size: ≤400mm X 500mm
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
Solder mask: Green, Black, Blue, Yellow, Red etc.
Coppweight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surfacre finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..
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20.7mil RO 4003C LoPro Double Layer Printed Circuit Board Hydrocarbon Ceramic


Double Layer Rogers PCB Built on 20.7mil RO4003C LoPro Reverse Treated Foil for Low Noise Block.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.


Features and Benefits:

RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density


Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility


Lead-free process compatible

1. High temperature processing

2. Meets environmental concerns


CAF resistant


Our PCB Capability (RO4003C LoPro)

PCB Material:Hydrocarbon Ceramic Laminates
Designation:RO4003C LoPro
Dielectric constant:3.38±0.05
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin etc..

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

2. Cellular base station antennas and power amplifiers

3. LNB’s for direct broadcast satellites

4. RF Identification Tags


Typical Properties of RO4003C LoPro

PropertyTypical ValueDirectionUnitsConditionTest Method
Dielectric Constant, Process3.38 ± 0.05z--10 GHz/23°CIPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design3.5z--8 to 40 GHzDifferential Phase Length Method
Dissipation Factor tan,0.0027 0.0021z--10 GHz/23°C 2.5 GHz/23°CIPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r40zppm/°C-50°C to 150°CIPC-TM-650 2.5.5.5
Volume Resistivity1.7 X 1010MΩ•cmCOND AIPC-TM-650 2.5.17.1
Surface Resistivity4.2 X 109COND AIPC-TM-650 2.5.17.1
Electrical Strength31.2(780)zKV/mm(V/mil)0.51mm(0.020”)IPC-TM-650 2.5.6.2
Tensile Modulus26889(3900)YMPa(kpsi)RTASTM D638
Tensile Strength141(20.4)YMPa(kpsi)RTASTM D638
Flexural Strength276(40)MPa(kpsi)IPC-TM-650 2.4.4
Dimensional Stability<0.3X,Ymm/m(mils/inch)after etch +E2/150°CIPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion11xppm/°C-55 to 288°CIPC-TM-650 2.1.41
14y
46z
Tg>280°C TMAAIPC-TM-650 2.4.24.3
Td425°C TGAASTM D3850
Thermal Conductivity0.64W/m/°K80°CASTM C518
Moisture Absorption0.06%48 hrs immersion 0.060” sample Temperature 50°CASTM D570
Density1.79gm/cm323°CASTM D792
Copper Peel Strength1.05(6.0)N/mm(pli)after solder float 1 oz. TC FoilIPC-TM-650 2.4.8
FlammabilityN/AUL 94
Lead-Free Process CompatibleYes


Quality 20.7mil RO 4003C LoPro Double Layer Printed Circuit Board Hydrocarbon Ceramic for sale
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